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IPC TM-650 Test Methods Manual

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아래는 IPC TM-650 Test Methods Manual 목록입니다.

[IPC Association Connecting Electronics Industries]

Test Methods Approved
SECTION 1.0 - Reporting and Measurement Analysis Methods
TM 1.1C Introduction – 1/03
TM 1.2A Calibration – 1/03
TM 1.3A Ambient Conditions – 1/03
TM 1.4A Reporting, General – 1/03
TM 1.5A Reporting, Format – 1/03
TM 1.6A Numerical Reporting – 1/03
TM 1.7A Reporting, Invalid Test Results – 1/03
TM 1.8A Measurement Precision Estimation for Binary Data – 1/03
Includes Calculator and User Guide
TM 1.9A Measurement Precision Estimation for Variables Data – 1/03
Includes Calculator and User Guide
SECTION 2.1 - Visual Test Methods
TM 2.1.1.1 Microsectioning, Ceramic Substrate – 12/87
TM 2.1.1.2A Microsectioning—Semi or Automatic Technique Microsection Equipment (Alternate) – 5/04
TM 2.1.2A Pinhole Evaluation, Dye Penetration Method – 3/76
TM 2.1.3A Plated-Through Hole Structure Evaluation – 8/76
TM 2.1.5A Surface Examination, Unclad and Metal-Clad Material – 12/82
TM 2.1.6B Thickness of Glass Fabric – 12/94
TM 2.1.6.1 Weight of Fabric Reinforcements – 12/94
renumbered from 2.3.12
TM 2.1.7C Thread Count of Glass Fabric – 12/94
TM 2.1.7.1 Thread Count, Organic Fibers – 12/87
TM 2.1.8B Workmanship – 12/94
TM 2.1.9 Surface Scratch Examination Metal-Clad Foil – 5/86
TM 2.1.1E Microsectioning, Manual Method – 5/04
TM 2.1.10A Visual Inspection for Undissolved Dicyandiamide – 12/94
TM 2.1.13B Inspection for Voids in Flexible Printed Board Materials – 5/12
SECTION 2.2 - Dimensional Test Methods
TM 2.2.1A Mechanical Dimensional Verification – 8/97
TM 2.2.2B Optical Dimensional Verification – 8/97
TM 2.2.4C Dimensional Stability, Flexible Dielectric Materials – 5/98
TM 2.2.5A Dimensional Inspections Using Mircosections – 8/97
TM 2.2.6A Hole Size Measurement, Drilled – 8/97
TM 2.2.7A Hole Size Measurement, Plated – 5/86
TM 2.2.8 Location of Holes – 4/73
TM 2.2.10A Hole Location and Conductor Location – 12/83
TM 2.2.12A Thickness of Copper by Weight – 3/76
TM 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated – 9/87
TM 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers – 7/89
TM 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers – 7/89
TM 2.2.13.1A Thickness, Plating in Holes, Microhm Method – 1/83
TM 2.2.14 Solder Powder Particle Size Distribution – Screen Method for Types 1-4 – 1/95
TM 2.2.14.1 Solder Powder Particle Size Distribution – Measuring Microscope Method – 1/95
TM 2.2.14.2 Solder Powder Particle Size Distribution – Optical Image Analyzer Method – 1/95
TM 2.2.14.3 Determination of Maximum Solder Powder Particle Size – 1/95
TM 2.2.15 Cable Dimensions (Flat Cable) – 6/79
TM 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel – 12/87
TM 2.2.16.1 Artwork Master Evaluation by Overlay – 12/87
TM 2.2.17A Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) – 2/01
TM 2.2.18 Determination of Thickness of Laminates by Mechanical Measurement – 12/94
TM 2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional – 12/94
TM 2.2.19 Measuring Hole Pattern Location – 12/87
TM 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels – 12/94
TM 2.2.20 Solder Paste Metal Content by Weight – 1/95
TM 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology – 11/98
SECTION 2.3 - Chemical Test Methods
TM 2.3.1 Chemical Processing, Suitable Processing Material – 4/73
TM 2.3.1.1B Chemical Cleaning of Metal-Clad Laminate – 5/86
TM 2.3.2G Chemical Resistance of Flexible Printed Board Materials – 12/07
TM 2.3.3A Chemical Resistance of Insulating Materials – 2/78
TM 2.3.4B Chemical Resistance, Marking Paints and Inks – 8/87
TM 2.3.4.2A Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure – 12/94
TM 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride – 5/86
TM 2.3.6A Etching Ammonium Persulfate Method – 7/75
TM 2.3.7A Etching, Ferric Chloride Method – 7/75
TM 2.3.7.1A Cupric Chloride Etching Method – 12/94
TM 2.3.7.2A Alkaline Etching Method – 12/94
TM 2.3.8A Flammability, Flexible Insulating Materials – 12/82
TM 2.3.8.1 Flammability of Flexible Printed Wiring – 12/88
TM 2.3.9D Flammability of Prepreg and Thin Laminate – 8/97
TM 2.3.10B Flammability of Laminate – 12/94
TM 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate – 8/98
TM 2.3.11 Glass Fabric Construction – 4/73
TM 2.3.13A Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods – 6/04
TM 2.3.14 Print, Etch, and Plate Test – 4/73
TM 2.3.15D Purity, Copper Foil or Plating – 5/04
TM 2.3.16B Resin Content of Prepreg, by Burn-off – 12/94
TM 2.3.16.1C Resin Content of Prepeg, by Treated Weight – 12/94
TM 2.3.16.2 Treated Weight of Prepreg – 12/94
TM 2.3.17D Resin Flow Percent of Prepreg – 8/97
TM 2.3.17.2B Resin Flow of “No Flow” Prepreg – 8/97
TM 2.3.18A Gel Time, Prepreg Materials – 4/86
TM 2.3.19C Volatile Content of Prepreg – 12/94
TM 2.3.21 Plating Quality Hull Cell Method – 8/97
TM 2.3.22 Copper Protective Coating Quality – 2/78
TM 2.3.23B Cure (Permanency) Thermally Cured Solder Mask – 2/88
TM 2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask – 2/88
TM 2.3.24 Porosity of Gold Plating – 2/78
TM 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method – 10/85
TM 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) – 8/97
TM 2.3.25D Detection and Measurement of Ionizable Surface Contaminations by Resistivity of Solvent Extract (ROSE) – 11/12
TM 2.3.25.1 Ionic Cleanliness Testing of Bare PWBs – 10/00
TM 2.3.27 Cleanliness Test – Residual Rosin – 1/95
TM 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method – 1/95
TM 2.3.28B Ionic Analysis of Circuit Boards, Ion Chromatography Method – 11/12
TM 2.3.28.1 Halide Content of Soldering Fluxes and Pastes – 6/04
TM 2.3.28.2 Bare Printed Board Cleanliness by Ion Chromatography – 12/09
TM 2.3.29 Flammability, Flexible Flat Cable – 11/88
TM 2.3.30A Solvent pH Determination in Anhydrous Flourocarbon Solvents – 11/81
TM 2.3.31 Relative Degree of Cure of U.V. Curable Material – 2/88
Reaffirmed
TM 2.3.32D Flux Induced Corrosion (Copper Mirror Method) – 6/04
TM 2.3.33D Presence of Halides in Flux, Silver Chromate Method – 6/04
TM 2.3.34C Solids Content, Flux – 6/04
TM 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder – 1/95
TM 2.3.35C Halide Content, Quantitative (Chloride and Bromide) – 6/04
TM 2.3.35.1A Fluorides by Spot Test, Fluxes – Qualitative – 6/04
TM 2.3.35.2A Flouride Concentration, Fluxes – Quantitative – 6/04
TM 2.3.36 Acid Acceptance of Chlorinated Solvents – 10/85
TM 2.3.37B Volatile Content of Adhesive Coated Dielectric Films – 5/98
TM 2.3.38C Surface Organic Contaminant Detection Test – 5/04
TM 2.3.39C Surface Organic Contaminant Identification Test (Infrared Analytical Method) – 5/04
TM 2.3.40 Thermal Stability – 7/95
TM 2.3.41 Test Method for Total Halogen Content in Base Materials – 4/06
TM 2.3.42 Solder Mask – Resistance to Solvents and Cleaning Agents – 3/07
SECTION 2.4 - Mechanical Test Methods
TM 2.4.1E Adhesion, Tape Testing – 5/04
TM 2.4.1.2 Adhesion of Conductors on Hybrid Substrates – 12/87
TM 2.4.1.3 Adhesion, Resistors (Hybrid Circuits) – 12/87
TM 2.4.1.4 Adhesion, Overglaze (Hybrid Circuits) – 12/87
TM 2.4.1.5A Determination of Treatment Transfer – 5/95
TM 2.4.1.6 Adhesion, Polymer Coating – 7/95
TM 2.4.2A Ductility of Copper Foil – 3/76
TM 2.4.2.1D Flexural Fatigue and Ductility, Foil – 3/91
TM 2.4.3E Flexural Fatigue, Flexible Printed Wiring Materials – 6/11
TM 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring – 3/91
TM 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics – 3/91
TM 2.4.4B Flexural Strength of Laminates (at Ambient Temperature) – 12/94
TM 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature) – 12/94
TM 2.4.5 Folding Endurance, Flexible Printed Wiring Materials – 4/73
TM 2.4.5.1 Flexibility – Conformal Coating – 7/00
TM 2.4.6 Hot Oil – 4/73
TM 2.4.7A Machinability, Printed Wiring Materials – 7/75
TM 2.4.7.1 Solder Mask – Determination of Machineability – 3/07
TM 2.4.8C Peel Strength of Metallic Clad Laminates – 12/94
TM 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) – 1/86
TM 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method) – 12/94
TM 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method) – 12/94
TM 2.4.8.4 Carrier Release, Thin Copper – 1/90
TM 2.4.9D Peel Strength, Flexible Dielectric Materials – 10/88
TM 2.4.9.1 Peel Strength of Flexible Circuits – 11/98
TM 2.4.9.2 Bonding Process – 11/98
TM 2.4.11 Shear Strength Flexible Dielectric Materials – 4/73
TM 2.4.12A Solderability, Edge Dip Method – 6/91
TM 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials – 5/98
TM 2.4.13.1 Thermal Stress of Laminates – 12/94
TM 2.4.14 Solderability of Metallic Surfaces – 4/73
TM 2.4.14.1 Solderability, Wave Solder Method – 3/79
TM 2.4.14.2A Liquid Flux Activity, Wetting Balance Method – 6/04
TM 2.4.15A Surface Finish, Metal Foil – 3/76
TM 2.4.16A Initiation Tear Strength, Flexible Insulating Materials – 12/82
TM 2.4.17 Tear Strength (Propagation) – 4/73
TM 2.4.17.1B Propagation Tear Strength, Flexible Insulating Material – 2/13
TM 2.4.18B Tensile Strength and Elongation, Copper Foil – 8/80
TM 2.4.18.1A Tensile Strength and Elongation, In-House Plating – 5/04
TM 2.4.18.2 Hot Rupture Strength, Foil – 7/89
TM 2.4.18.3 Tensile Strength, Elongation, and Modulus – 7/95
TM 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials – 5/98
TM 2.4.20 Terminal Bond Strength, Flexible Printed Wiring – 4/73
TM 2.4.21E Land Bond Strength, Unsupported Component Hole – 5/04
TM 2.4.22C Bow and Twist (Percentage) – 6/99
TM 2.4.22.1C Bow and Twist-Laminate – 5/93
TM 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics – 7/95
TM 2.4.23 Soldering Resistance of Laminate Materials – 3/79
TM 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA – 12/94
TM 2.4.24.1 Time to Delamination (TMA Method) – 12/94
TM 2.4.24.2 Glass Transition Temperature of Organic Films – DMA Method – 7/95
TM 2.4.24.3 Glass Transition Temperature of Organic Films – TMA Method – 7/95
TM 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method – 11/98
TM 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method – 11/98
TM 2.4.24.6 Decomposition Temperature (Td) of Laminate Material Using TGA – 4/06
TM 2.4.25C Glass Transition Temperature and Cure Factor by DSC – 12/94
TM 2.4.26 Tape Test for Additive Printed Boards – 3/79
TM 2.4.27.1B Abrasion (Taber Method) Solder Mask and Conformal Coating – 1/95
TM 2.4.27.2A Solder Mask Abrasion (Pencil Method) – 2/88
Reaffirmed
TM 2.4.28B Adhesion, Solder Mask (Non-Melting Metals) – 8/97
TM 2.4.28.1F Solder Mask Adhesion – Tape Test Method – 3/07
TM 2.4.29C Adhesion, Solder Mask, Flexible Circuit – 3/07
TM 2.4.30 Impact Resistance, Polymer Film – 10/86
TM 2.4.31A Folding, Flexible Flat Cable – 4/86
TM 2.4.32A Fold Temperature Testing, Flexible Flat Cable – 4/86
TM 2.4.33C Flexural Fatigue and Ductility, Flat Cable – 3/91
TM 2.4.34 Solder Paste Viscosity – T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose) – 1/95
TM 2.4.34.1 Solder Paste Viscosity – T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose) – 1/95
TM 2.4.34.2 Solder Paste Viscosity – Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose) – 1/95
TM 2.4.34.3 Solder Paste Viscosity – Spiral Pump Method (Applicable at Less Than 300,000 Centipose) – 1/95
TM 2.4.34.4 Paste Flux Viscosity – T-Bar Spindle Method – 1/95
TM 2.4.35 Solder Paste – Slump Test – 1/95
TM 2.4.36C Rework Simulation, Plated-Through Holes for Leaded Components – 5/04
TM 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections – 7/91
TM 2.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring Board Applications – 7/91
TM 2.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads – 7/93
TM 2.4.38A Prepeg Scaled Flow Testing – 6/91
TM 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates – 2/86
TM 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards – 10/87
TM 2.4.41 Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards – 3/86
TM 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method – 8/97
TM 2.4.41.2A Coefficient of Thermal Expansion – Strain Gage Method – 5/04
TM 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films – 7/95
TM 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates – 7/95
TM 2.4.42 Torsional Strength of Chip Adhesives – 2/88
TM 2.4.42.1 High Tempreature Mechanical Strength Retention of Adhesives – 3/88
TM 2.4.42.2 Die Shear Strength – 2/98
TM 2.4.42.3 Wire Bond Pull Strength – 2/98
TM 2.4.43 Solder Paste – Solder Ball Test – 1/95
TM 2.4.45 Solder Paste – Wetting Test – 1/95
TM 2.4.46A Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms – 6/04
TM 2.4.47 Flux Residue Dryness – 1/95
TM 2.4.48 Spitting of Flux-Cored Wire Solder – 1/95
TM 2.4.49 Solder Pool Test – 1/95
TM 2.4.50 Thermal Conductivity, Polymer Films – 7/95
TM 2.4.51 Self Shimming Thermally Conductive Adhesives – 1/95
TM 2.4.52 Fracture Toughness of Resin Systems for Base Materials – 10/13
SECTION 2.5 - Electrical Test Methods
TM 2.5.1B Arc Resistance of Printed Wiring Material – 5/86
TM 2.5.2A Capacitance of Insulating Materials – 7/75
TM 2.5.3B Current Breakdown, Plated Through-Holes – 8/97
TM 2.5.4 Current Carrying Capacity, Multilayer Printed Wring – 4/73
TM 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors – 8/97
TM 2.5.5A Dielectric Constant of Printed Wiring Materials – 7/75
TM 2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems) – 5/86
TM 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material–Clip Method – 12/87
TM 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method) – 12/87
TM 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material–Micrometer Method – 10/85
TM 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band – 3/98
TM 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ – 3/98
TM 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates – 5/89
TM 2.5.5.7A Characteristic Impedance Lines on Printed Boards by TDR – 3/04
TM 2.5.5.8 Low Frequency Dielectric Constant and Loss Tangent, Polymer Films – 7/95
TM 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz – 11/98
TM 2.5.5.10 High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials – 7/05
TM 2.5.5.11 Propagation Delay of Lines on Printed Boards by TDR – 4/09
TM 2.5.5.12A Test Methods to Determine the Amount of Signal Loss on Printed Boards – 7/12
TM 2.5.5.13 Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator – 1/07
TM 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material – 5/86
TM 2.5.6.1B Solder Mask – Dielectric Strength – 3/07
TM 2.5.6.2A Electric Strength of Printed Wiring Material – 8/97
TM 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength – 10/86
TM 2.5.7D Dielectric Withstanding Voltage, PWB – 5/04
TM 2.5.7.1 Dielectric Withstanding Voltage – Polymeric Conformal Coating – 7/00
TM 2.5.7.2A Dielectric Withstanding Voltage (HiPot Method) – Thin Dielectric Layers for Printed Boards – 11/09
TM 2.5.8A Dissipation Factor of Flexible Printed Wiring Material – 7/75
TM 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds – 11/98
TM 2.5.12 Interconnection Resistance, Multilayer Printed Wiring – 4/73
TM 2.5.13A Resistance of Copper Foil – 3/76
TM 2.5.14A Resistivity of Copper Foil – 8/76
TM 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable – 10/86
TM 2.5.16A Shorts, Internal on Multilayer Printed Wiring – 11/88
TM 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials – 5/98
TM 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials – 12/94
TM 2.5.17.2 Volume Resistivity of Conductive Materials Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method – 11/98
TM 2.5.18B Characteristic Impedance Flat Cables (Unbalanced) – 7/84
TM 2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer – 7/84
TM 2.5.19.1A Propagation Delay of Flat Cables Using Dual Trace Oscilloscope – 7/84
TM 2.5.21A Digital Unbalanced Crosstalk, Flat Cable – 3/84
TM 2.5.24 Conductor Resistance, Flexible Flat Cable – 6/79
TM 2.5.25A Dielectric Withstand Voltage Flexible Fat Cable – 11/85
TM 2.5.26A Insulation Resistance Flexible Flat Cable – 11/85
TM 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material – 3/79
TM 2.5.28A Q Resonance, Flexible Printed Wiring Materials – 4/88
TM 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements – 12/87
TM 2.5.31 Current Leakage (Through Overglaze Films) – 12/87
TM 2.5.32 Resistance Test, Plated Through-Holes – 12/87
TM 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools – 11/98
TM 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools – Ground Measurements – 11/98
TM 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools – Transient Measurements – 11/98
TM 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools – Current Leakage Measurements – 11/98
TM 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools – Shielded Enclosure – 11/98
TM 2.5.34 Power Density Rating for Embedded Resistors – 7/12
SECTION 2.6 - Environmental Test Methods
TM 2.6.1G Fungus Resistance Printed Wiring Materials – 3/07
TM 2.6.1.1 Fungus Resistance – Conformal Coating – 7/00
TM 2.6.2D Moisture Absorption, Flexible Printed Wiring – 2/12
TM 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates – 5/86
TM 2.6.3F Moisture and Insulation Resistance, Printed Boards – 5/04
TM 2.6.3.1E Solder Mask – Moisture and Insulation Resistance – 3/07
TM 2.6.3.2B Insulation and Moisture Resistance, Flexible Base Dielectric – 5/88
TM 2.6.3.3B Surface Insulation Resistance, Fluxes – 6/04
TM 2.6.3.4A Moisture and Insulation Resistance – Conformal Coating – 7/03
Supersedes 2.6.3.4 and 2.6.3.1C for Conformal Coating Test
TM 2.6.3.5 Bare Board Cleanliness by Surface Insulation Resistance – 1/04
TM 2.6.3.6 Surface Insulation Resistance – Fluxes – Telecommunications – 1/04
TM 2.6.3.7 Surface Insulation Resistance – 3/07
TM 2.6.4B Outgassing, Printed Boards – 5/04
TM 2.6.5D Physical Shock, Multilayer Printed Wiring – 5/04
TM 2.6.6B Temperature Cycling, Printed Wiring Board – 12/87
TM 2.6.7A Thermal Shock and Continuity, Printed Board – 8/97
TM 2.6.7.1A Thermal Shock – Conformal Coating – 7/00
Supersedes 2.6.7.1 for Conformal Coating Tests
TM 2.6.7.2B Thermal Shock, Continuity and Microsection, Printed Board – 5/04
TM 2.6.7.3 Thermal Shock – Solder Mask – 7/00
Supersedes 2.6.7.1 for Solder Mask Test
TM 2.6.8E Thermal Stress, Plated-Through Holes – 5/04
TM 2.6.8.1 Thermal Stress, Laminate – 9/91
TM 2.6.9B Vibration, Rigid Printed Wiring – 5/04
TM 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy – 1/95
TM 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy – 1/95
TM 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods – 8/97
TM 2.6.11B Hydrolytic Stability Solder Mask and/or Conformal Coating – 8/98
TM 2.6.11D Solder Mask – Hydrolytic Stability – 3/07
TM 2.6.11.1 Hydrolytic Stability – Conformal Coating – 7/00
Supersedes 2.6.11B for Conformal Coating Test
TM 2.6.12 Temperature Testing, Flexible Flat Cable – 6/79
TM 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring – 10/85
TM 2.6.14D Solder Mask – Resistance to Electrochemical Migration – 3/07
TM 2.6.14.1 Electrochemical Migration Resistance Test – 9/00
TM 2.6.15C Corrosion, Flux – 6/04
TM 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity – 7/85
TM 2.6.16.1 Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel) – 8/98
TM 2.6.17 Hydrolitic Stability, Flexible Printed Wiring Material – 12/82
TM 2.6.18A Low Temperature Flexibility, Flexible Printed Wiring Materials – 7/85
TM 2.6.19 Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards – 12/87
TM 2.6.21B Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films – 6/11
TM 2.6.23 Test Procedure for Steam Ager Temperature Repeatability – 7/93
TM 2.6.24 Junction Stability Under Environmental Conditions – 11/98
TM 2.6.25A Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis – 5/12
TM 2.6.26 DC Current Induced Thermal Cycling Test – 5/01
TM 2.6.27 Thermal Stress, Convection Reflow Assembly Simulation – 5/09
TM 2.6.28 Moisture Content and/or Moisture Absorption Rate, (Bulk) Printed Board – 8/10

Old
SECTION 3.0 - Connector Test Methods
TM 3.1A Contact Resistance, Connectors – 7/75
TM 3.2A Contact Retention, Connectors – 7/75
TM 3.3A Crimp Tensil Strength, Connectors – 7/75
TM 3.4B Durability, Connectors – 1/83
TM 3.5A Humidity, Connectors – 7/75
TM 3.6A Insulation Resistance, Connectors – 7/75
TM 3.7A Low Level Circuit Connectors – 7/75
TM 3.8A Mechanical Shock, Connectors – 7/75
TM 3.9A Salt Spray, Connectors – 7/75
TM 3.10A Solderability, Connectors – 7/75
TM 3.11A Thermal Shock, Connectors – 7/75
TM 3.12A Vibration, Connectors – 7/75
TM 3.13A Withstanding Voltage, Connectors – 7/75
TM 3.14 High Temperature Life, Connectors – 7/75
TM 3.15 Fungus Resistance, Connectors – 7/79
TM 3.16 Fretting Corrosion, Connectors – 2/78
TM 3.17 Industrial Gas Test (Battelle Method), Connectors – 2/78
TM 3.18 Mating and Unmating Force, Connectors – 1/83

Cancelled
SECTION 2.2 - Dimensional Test Methods
TM 2.2.17 Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) – 3/90
SECTION 2.3 - Chemical Test Methods
TM 2.3.5B Density, Insulating Material – 8/97
TM 2.3.25B Detection and Measurement of Ionizable Surface Contaminants – 8/97
Supersedes 2.3.26 and 2.3.26.1
TM 2.3.26A Superseded by Test Method 2.3.25 – 2/88
Superseded by Test Method 2.3.25
TM 2.3.26.1 Superseded by Test Method 2.3.25 – 2/88
Superseded by Test Method 2.3.25
TM 2.3.26.2 Mobile Ion Content of Polymer Films – 7/95
SECTION 2.4 - Mechanical Test Methods
TM 2.4.1.1B Adhesion, Marking Paints and Inks – 11/88
TM 2.4.10 Plating Adhesion – 4/73
SECTION 2.5 - Electrical Test Methods
TM 2.5.7.2 Dielectric Withstanding Voltage (HiPot Method) – Thin Dielectric Layers for Printed Circuit Boards (PCBs) – 12/07
TM 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer) – 4/73
SECTION 2.6 - Environmental Test Methods
TM 2.6.7.1 Thermal Shock – Conformal Coating – 7/00
Supersedes 2.6.7.1 for Conformal Coating Tests
TM 2.6.20A 2.6.20A – 1/95
Superseded by J-STD-020A
TM 2.6.22 2.6.22 – 1/95
Superseded by J-STD-035

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